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CMP for semiconductor devices
The wafer manufacturing process consists of seven independent processes: lithography, etching, film growth, diffusion, ion implantation, chemical-mechanical polishing, and metallization. As one of the key process processes of wafer manufacturing, chemical mechanical polishing (CMP) refers to the efficient removal of excess materials on the wafer surface and the global nano level flattening through the cooperative action of chemical corrosion and mechanical grinding.
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Advantages, technical difficulties and realizable areas of micro-LED
Despite the rapid development of solid-state lighting, display backlighting is still a substantial market for leds. For more than a decade, screens have been displayed by these devices initially placed in traditional packages, and more recently in chip-level packages, and they are now the backlight for LCDS.