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HK Xinyutong Optoelectronic Co., Ltd

One-stop polishing solutions , from the latest machines and equipment to grinding compound.

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  • Contact Person: Mr Lin

  • Mobile: +8615702088819

  • E-mail: lwc@szxinyutong.com

  • TEL: +86075523496070

  • ADD: Office address: Flat C 4/F, Civic Comm BLDG, 165-167, WooSung ST, KL,HongKong
    Factory Address:East Floor 5, Building 3, Fubilun Dingfeng High-tech Industrial Park, West of Songgang Avenue, Bao'an District, Shenzhen City.

News
XYT Xinyutong’s Pure-Water-Based MPO/MTP Lapping & Polishing Materials Make a Highlight Appearance at the 26th CIOE

Shenzhen Xinyutong Photoelectric Co., Ltd. sincerely invites you to visit the 26th China International Optoelectronic Exposition (CIOE), and witness the exciting debut of innovative technologies and products with us!

XYT Achieves Resounding Success at CIOE 2026 with Ultra-Pure Water Lapping and Polishing Solutions in the Spotlight

Recently, the three-day 27th China International Optoelectronic Exposition (CIOE 2026) concluded successfully at the Shenzhen World Exhibition & Convention Center. As one of the largest and most influential flagship exhibitions for the optoelectronics industry in the Asia-Pacific region, CIOE continues to lead technological iteration and industrial direction

Xinyutong Showcases Exclusive Patent 2-in-1 MT/MPO Grinding and Polishing Product at the 25th China International Optoelectronic Exposition

From September 11th to 13th, 2024, the 25th China International Optoelectronic Exposition (CIOE 2024) was grandly held at Shenzhen World Exhibition & Convention Center (Bao'an New Hall). As a globally watched comprehensive event in the optoelectronic industry, this exhibition gathered more than 3,700 exhibitors from over 30 countries and regions, covering an exhibition area of 240,000 square meters and attracting over 120,000 professional visitors.

Xinyutong Technology showcased its independently developed and exclusively patented 2-in-1 grinding and polishing product for MT/MPO at this optoelectronic expo, becoming one of the highlights on site. This product innovatively integrates the two processes of precision grinding and efficient polishing, enhancing the consistency and efficiency of end-face processing, and meeting the higher requirements for the quality and craftsmanship of multi-core connectors in the current high-speed optical communication field.

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